Thick Film Chip Thermistors (In Development)

HOME>Thick Film Chip Thermistors (In Development)

Advantages	High temperature sensing, control and compensation are optimized. Wide temperature ranges from -40℃ to +200℃ are ideal for SiC and GaN. The top surface has two electrodes Au or Ag perfectly suitable for wire bonding. The bottom surface is metallized with Ag for sintering. The alumina base and glass coating ensure high mechanical strength. The compact cubic volume and exceptional thermal capacity provide unparalleled thermal response. Thermal Response has a minimal thermal capacity, yet the sensitivity of the sensor is increased. AEC-Q200 compliant product.

Advantages

High temperature sensing, control and compensation are optimized.
Wide temperature ranges from -40℃ to +200℃ are ideal for SiC and GaN.
The top surface has two electrodes Au or Ag perfectly suitable for wire bonding.
The bottom surface is metallized with Ag for sintering.
The alumina base and glass coating ensure high mechanical strength.
The compact cubic volume and exceptional thermal capacity provide unparalleled thermal response.
Thermal Response has a minimal thermal capacity, yet the sensitivity of the sensor is increased.
AEC-Q200 compliant product.