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BULK CHIP (In Development)

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BULK CHIP (In Development)

NTC Bulk Chip Thermistor for 200°C for Wire Bonding In development

Advantages
  • Wide temperature ranges from -40°C to +200°C are ideal for SiC and GaN.
  • Electrodes can be selected from Au (gold) or Ag (silver) depending on the application.
  • Our unique formulation method customizes resistance and B constant to your specifications and requirements.
  • The ultra-compact type contributes to thinner mounting boards.
  • Thermal Response: Featuring minimal thermal capacity, yet heightened sensor sensitivity.
  • Can be used for a wide range of applications including high-precision temperature measurement,
    temperature compensation, and temperature adjustment.
  • AEC-Q200 compliant product.
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