TWT Wire Bondable Thick Film Chip Thermistor

Optimized for high temperature sensing, control, and compensation.

Wide temperature ranges from -50℃ to +200℃ are ideal for SiC and GaN.

The top surface has two electrodes Ag perfectly suitable for wire bonding.

The bottom surface is metallized with Ag for sintering.

Empowered by an Alumina base and Glass coating, ensuring high mechanical strength.

Unparalleled thermal responsiveness due to its compact cubic volume and exceptional heat capacity.

Thermal Response: Featuring minimal thermal capacity, yet heightened sensor sensitivity.

AEC-Q200 compliant product.

Formic acid reflow compliant product.